Flexible Electronics News

Printed Electronics Insights: Smart Packaging & IoT is Oct. 12

OE-A, EPSRC, FlexTech host conference covering the field of printed electronics.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Together with EPSRC Centre for Innovative Manufacturing in Large-Area Electronics/University of Cambridge, OE-A is organizing “Printed Electronics Insights: Smart Packaging & IoT,” a day of presentations and a panel discussion co-sponsored by FlexTech.   The event will be held on Thursday, Oct. 12, 2017 at Robinson College, Cambridge, UK, with company tours and a networking reception on the day before during the 41th OE-A Working Group Meeting (Oct. 11, 2017).   Inspired by a keynote on ...

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